NC25SC
Semiconductor cleaning, adapted to the cleanroom
An evolution of the NC25 for semiconductors: adapted to the cleanroom, it meets the sector's strict criteria while reducing costs.
Application
The NC25SC cleans wafers, hybrids, power modules, IMS and lead frames. Derived from the NC25, it is designed for the cleanroom environment and meets the demanding requirements of the semiconductor industry.
Benefits
- Adapted to the cleanroom environment
- Meets the demanding semiconductor criteria
- Spray under immersion, closed-loop rinsing, vacuum drying
- Reduced running costs
Process diagram
Technical specifications
Footprint & mass
- Dimensions (W × D × H)
- 1,600 × 1,000 × 2,000 mm/ 63 × 39.4 × 78.7 in
- Weight
- 750 kg/ 1,653 lb
Process
- Wash tank
- 80 L/ 21.1 US gal
- Rinse 1
- 60 L/ 15.9 US gal
- Rinse 2
- 60 L/ 15.9 US gal
- Drying vacuum (max)
- -0.8 bar/ -12 psi
Frequently asked questions
What parts does the NC25SC handle?
Wafers, hybrids, power modules, IMS substrates and lead frames. The machine is adapted to cleanroom use and to semiconductor cleanliness criteria.
Is this machine right for your requirement?
Let's talk about your parts, your contaminants and your throughput. We validate the process on real trials.
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